镭射修补机                

项目                                       说明

镭射种类                                 ND:YAG Laser

镭射波长                                 1064nm/532nm/355nm/266nm

镭射功率(*大輸出)                        0.5mJ/pulse

Peak Power                               100W

1064波幅                                 4-6nsec

发振频率                                 1Hz

冷卻方法                                 风冷式

输出能量控制                             1000 steps for 0-100%※Hi/Low switch-able

Flash Lamp Life time                        1年或大于10000000shots

镭射器保固期                              1年

介面                                     RS-232

(依实际镭射配置规格为准)

1 Laser Slit

      项目                                       说明

                                       物镜倍率      加工尺寸

     修补尺寸                          NIR 50x 物镜    min: 1um x1um

                                     NIR 20x 物镜    max: 120um x 120um

2 光学影像系统

项目                                             说明

显微镜                                        观测/镭射加工专用型

CCD                                          1/2”Color CCD

落射光源                                      高亮度卤素光源系统(100W)

透射光源                                      高亮度卤素光源系统(150W)

Guide Light                                    高亮度卤素光源系统(100W)

物镜切换系统                                  4孔/电动切换式(线性)

3 精密物镜组

项目                                           说明

M Plan APO 5 x                                 观察

M Plan APO 10 x                                观察

M Plan NIR 20 x                                观察/镭射加工

M Plan NIR 50 x                                观察/镭射加工

4 自动对焦系统

项目                                           说明

对焦类型                                     手动式对焦

5 加工载台

项目                                           说明

主要功能                                      工件承载使用

材质                                          精密大理石平台

尺寸                                          400mm x 300mm

底座                                          大理石底座

Features:

All In One design removes the power supply and umbilical

Air-cooled, Compact, No maintenance needed

Cutting size from 1µm x 1µm (under 100X objective) to 50µm x 50µm (under 50X objective).

Simple communication via USB or remote control box

Precise energy control with 1000 steps

Optional Internal CCD camera

Internal LED or External Whitelight spot marker

Mountable on most Failure Analysis microscopes

Specification

Standard Optical Energy Option  IR -1064 nm  Green -532 nm  UV3 -355 nm  UV4 -266 nm UV5 -213 nm

Repetition Rate Single shot, 1 Hz continuous, or Burst Mode

Spot Marker  Internal Blue LED or External Whitelight

Communication  USB to computer/ HDMI to remote control box

CCD Camera Optional (integrated inside the laser)

Output Polarizer Rotation  Optional

Environmental Requirements
Cooling Air
Voltage 24 VDC
Temperature (operating) 10° – 30° C (50° – 86° F)
Temperature (non-operating) 0° – 50° C (32° – 122° F)
Relative Humidity 20% – 80% non-condensing
Physical Size and Weight
Width 6.5” / 165 mm
Depth 3.75” / 95 mm
Height 10.75” / 283 mm
Weight 8.0 lbs / 3.6 kg